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 FGA70N33BTD 330V, 70A PDP IGBT
November 2008
FGA70N33BTD
330V, 70A PDP IGBT
Features
* High current capability * Low saturation voltage: VCE(sat) =1.7V @ IC = 70A * High input impedance * Fast switching * RoHS Compliant
tm
General Description
Using Novel Trench IGBT Technology, Fairchild's new series of trench IGBTs offer the optimum performance for PDP applications where low conduction and switching losses are essential.
Applications
* PDP System
C
G
TO-3P
GCE
E
Absolute Maximum Ratings T
Symbol
VCES VGES ICpulse(1)* IC pulse(2)* PD VRRM IF(AV) IFSM TJ, Tstg TL Collector to Emitter Voltage Gate to Emitter Voltage Pulsed Collector Current Pulsed Collector Current
C
= 25C unless otherwise noted
Description
Ratings
330 30 @ TC = 25 C @ TC = 25oC @ TC = 25 C @ TC = 100 C
o o o o
Units
V V A A W W V A A
o o
160 220 149 60 330 10 100 -55 to +150 300
Maximum Power Dissipation Maximum Power Dissipation
Peak Repetitive Reverse Voltage of Diode Average Rectified Forward Current of diode @ TC = 100 C Non-repetitive Peak Surge Current of diode 60Hz Single Half-Sine wave Operating Junction Temperature and Storage Temperrature Maximum Lead Temp. for soldering Purposes, 1/8" from case for 5 seconds
C C
Thermal Characteristics
Symbol
RJC(IGBT) RJC(Diode) RJA
Parameter
Thermal Resistance, Junction to Case Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient
Typ.
----
Max.
0.84 1.57 40
Units
o o o
C/W C/W C/W
Notes: 1: Repetitive test , Pulse width=100usec , Duty=0.1 2: Half Sine Wave, D< 0.01, pluse width < 5usec *IC_pulse limited by max Tj
(c)2008 Fairchild Semiconductor Corporation
1
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FGA70N33BTD Rev. A
FGA70N33BTD 330V, 70A PDP IGBT
Package Marking and Ordering Information
Device Marking
FGA70N33BTD
Device
FGA70N33BTDTU
Package
TO-3P
Packaging Type
Tube
Max Qty Qty per Tube
30ea
per Box
--
Electrical Characteristics of the IGBT
Symbol
Off Characteristics BVCES BVCES/ TJ ICES IGES
TC = 25C unless otherwise noted
Parameter
Test Conditions
Min.
Typ.
Max.
Units
Collector to Emitter Breakdown Voltage VGE = 0V, IC = 250A Temperature Coefficient of Breakdown Voltage Collector Cut-Off Current G-E Leakage Current VGE = 0V, IC = 250uA VCE = VCES, VGE = 0V VGE = VGES, VCE = 0V
330 ----
-0.3 ---
--250 400
V V/oC A nA
On Characteristics VGE(th) G-E Threshold Voltage IC = 250A, VCE = VGE IC = 20A, VGE = 15V VCE(sat) Collector to Emitter Saturation Voltage IC = 40A, VGE = 15V, IC = 70A, VGE = 15V, TC = IC = 70A, VGE = 15V, TC = 125oC Dynamic Characteristics Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance VCE = 30V, VGE = 0V, f = 1MHz ---1380 140 60 ---pF pF pF 25oC 2.3 ----3.3 1.1 1.4 1.7 1.8 4.3 ----V V V V V
Switching Characteristics td(on) tr td(off) tf td(on) tr td(off) tf Qg Qge Qgc Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate to Emitter Charge Gate to Collector Charge VCE = 200V, IC = 20A, VGE = 15V VCC = 200V, IC = 20A, RG = 5, VGE = 15V, Resistive Load, TC = 125oC VCC = 200V, IC = 20A, RG = 5, VGE = 15V, Resistive Load, TC = 25oC -----------13 26 46 198 13 28 48 268 49 6.8 17.5 -----------ns ns ns ns ns ns ns ns nC nC nC
FGA70N33BTD Rev. A
2
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FGA70N33BTD 330V, 70A PDP IGBT
Electrical Characteristics of the Diode
Symbol
VFM trr Irr
TC = 25C unless otherwise noted
Parameter
Diode Forward Voltage IF = 10A
Test Conditions
TC = 25oC TC = 125oC TC = 25oC TC = 125oC 125oC TC = 25oC TC = TC = 25oC TC = 125oC
Min.
---------
Typ.
1.1 0.95 23 36 2.8 5.1 32 91
Max
1.5 --------
Units
V
Diode Reverse Recovery Time IF =10A, dI/dt = 200A/s
ns
Diode Peak Reverse Recovery Current Diode Reverse Recovery Charge
A
Qrr
nC
FGA70N33BTD Rev. A
3
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FGA70N33BTD 330V, 70A PDP IGBT
Typical Performance Characteristics
Figure 1. Typical Output Characteristics
220
TC = 25 C
o
Figure 2. Typical Output Characteristics
220
TC = 125 C
o
20V 15V
12V
20V
Collector Current, IC [A]
Collector Current, IC [A]
176
10V
176
15V
132
132
12V
88
8V
88
10V
44
44
8V
0 0 1 2 3 4 Collector-Emitter Voltage, VCE [V] 5
0 0 1 2 3 4 Collector-Emitter Voltage, VCE [V] 5
Figure 3. Typical Saturation Voltage Characteristics
220
Common Emitter VGE = 15V
Figure 4. Transfer Characteristics
220
Collector Current, IC [A]
176
TC = 25 C TC = 125 C
o
o
176 Collector Current, Ic [A]
Common Emitter Vce = 20V o Tc=25 C o Tc=125 C
132
132
88
88
44
44
0 0 1 2 3 4 5 Collector-Emitter Voltage, VCE [V] 6
0 0 2 4 6 8 10 Gate-Emitter Voltage, Vge [V] 12 14 16
Figure 5. Saturation Voltage vs. Case Temperature at Variant Current Level
2.0
Collector-Emitter Voltage, VCE [V]
Common Emitter VGE = 15V
Figure 6. Saturation Voltage vs. VGE
20
Collector-Emitter Voltage, VCE [V]
Common Emitter TC = 25 C
o
1.8
70A
16
1.6 1.4
40A
12
1.2 1.0 0.8 25
8
40A 70A
IC = 20A
4
IC = 20A
50 75 100 125 150 o Collector-EmitterCase Temperature, TC [ C]
0
0
4 8 12 16 Gate-Emitter Voltage, VGE [V]
20
FGA70N33BTD Rev. A
4
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FGA70N33BTD 330V, 70A PDP IGBT
Typical Performance Characteristics
Figure 7. Saturation Voltage vs. VGE
20
Common Emitter TC = 125 C
o
Figure 8. Capacitance Characteristics
10000
Common Emitter VGE = 0V, f = 1MHz Cies TC = 25 C
o
Collector-Emitter Voltage, VCE [V]
16
Capacitance [pF]
1000
Coes Cres
12
8
40A
100
4
70A IC = 20A
0 0 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20
10 1 10 Collector-Emitter Voltage, VCE [V]
30
Figure 9. Gate charge Characteristics
15
Common Emitter TC = 25 C VCC = 100V
o
Figure 10. SOA Characteristics
500 100
Collector Current, Ic [A]
10s
Gate-Emitter Voltage, VGE [V]
12
100s
9
200V
10
1ms 10ms
6
1
DC
Single Nonrepetitive Pulse TC = 25oC Curves must be derated linearly with increase in temperature
3
0.1
0 0 10 20 30 40 Gate Charge, Qg [nC] 50 60
0.01 0.1
1 10 100 Collector-Emitter Voltage, VCE [V]
400
Figure 11. Turn-on Characteristics vs. Gate Resistance
200 100
tr
Figure 12. Turn-off Characteristics vs. Gate Resistance
1000
tf
Switching Time [ns]
Switching Time [ns]
td(off)
10
td(on) Common Emitter VCC = 200V, VGE = 15V IC = 20A TC = 25 C TC = 125 C
o o
100
Common Emitter VCC = 200V, VGE = 15V IC = 20A TC = 25 C TC = 125 C
o o
1 0 15 30 45 Gate Resistance, RG [] 60
10
0
15 30 45 Gate Resistance, RG []
60
FGA70N33BTD Rev. A
5
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FGA70N33BTD 330V, 70A PDP IGBT
Typical Performance Characteristics
Figure 13. Turn-on Characteristics vs. Collector Current
1000
Common Emitter VGE = 15V, RG = 5 TC = 25 C
o o
Figure 14. Turn-off Characteristics vs. Collector Current
1000
tf
Switching Time [ns]
100
TC = 125 C
Switching Time [ns]
tr
100
td(off)
10
td(on)
10
Common Emitter VGE = 15V, RG = 5 TC = 25 C TC = 125 C
o o
1 20
30
40
50
60
70
1 20
30
40
50
60
70
Collector Current, IC [A]
Collector Current, IC [A]
Figure 15. Switching Loss vs. Gate Resistance
1000
Eoff
Figure 16. Switching Loss vs. Collector Current
3000 1000
Switching Loss [mJ]
Eoff
Switching Loss [mJ]
100
Eon
Eon
100
10
Common Emitter VCC = 200V, VGE = 15V IC = 20A TC = 25 C TC = 125 C
o o
10
Common Emitter VGE = 15V, RG = 5 TC = 25 C TC = 125 C
o o
1
0
10
20 30 40 Gate Resistance, RG []
50
1 20
30
40
50
60
70
Collector Current, IC [A]
Figure 17. Turn off Switching SOA Characteristics Figure 18. Forward Characteristics
400
100
Collector Current, IC [A]
Forward Current, IF [A]
100
TC = 125 C
o
10
TC = 25 C
o
10
Safe Operating Area VGE = 15V, TC = 125 C
o
TC = 25 C TC = 125 C
o
o
1 1 10 100 600
Collector-Emitter Voltage, VCE [V]
1 0 0.5 1.0 1.5 2.0 Forward Voltage, VF [V] 2.5
FGA70N33BTD Rev. A
6
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FGA70N33BTD 330V, 70A PDP IGBT
Typical Performance Characteristics
Figure 19. Reverse Recovery Current
4
Stored Recovery Charge, Qrr [nC]
Reverse Recovery Currnet, Irr [A]
Figure 20. Stored Charge
60
200A/s
3
45
200A/s
2
di/dt = 100A/s
30
di/dt = 100A/s
1
15
0 5 10 20 30 Forward Current, IF [A] 40
0 5 10 20 30 40
Forward Current, IF [A]
Figure 21. Reverse Recovery Time
40
Reverse Recovery Time, trr [ns]
30
200A/s
20
di/dt = 100A/s
10
5
10
20
30
40
Forward Current, IF [A]
Figure 22.Transient Thermal Impedance of IGBT
1
Thermal Response [Zthjc]
0.5 0.2
0.1
0.1 0.05 0.02 0.01
PDM t1 t2
0.01 single pulse
Duty Factor, D = t1/t2 Peak Tj = Pdm x Zthjc + TC
1E-3 1E-5
1E-4
1E-3
0.01
0.1
1
10
Rectangular Pulse Duration [sec]
FGA70N33BTD Rev. A
7
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FGA70N33BTD 330V, 70A PDP IGBT
Mechanical Dimensions
TO-3P
Dimensions in Millimeters
FGA70N33BTD Rev. A
8
www.fairchildsemi.com
FGA70N33BTD 330V, 70A PDP IGBT
TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. Build it NowTM CorePLUSTM CorePOWERTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) EfficentMaxTM EZSWITCHTM *
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(R)
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Programmable Active DroopTM QFET(R) QSTM Quiet SeriesTM RapidConfigureTM
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PDP SPMTM Power-SPMTM PowerTrench(R) PowerXSTM
TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TM TinyPowerTM Saving our world, 1mW /W /kW at a timeTM TinyPWMTM SmartMaxTM TinyWireTM SMART STARTTM SerDesTM SPM(R) STEALTHTM SuperFETTM UHC(R) SuperSOTTM-3 Ultra FRFETTM SuperSOTTM-6 UniFETTM SuperSOTTM-8 VCXTM SupreMOSTM VisualMaxTM SyncFETTM XSTM (R) The Power Franchise(R)
* EZSWITCHTM and FlashWriter(R) are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support, device, or 1. Life support devices or systems are devices or systems which, (a) are system whose failure to perform can be reasonably expected to cause intended for surgical implant into the body or (b) support or sustain life, the failure of the life support device or system, or to affect its safety or and (c) whose failure to perform when properly used in accordance with effectiveness. instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Farichild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Farichild strongly encourages customers to purchase Farichild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handing and storage and provide access to Farichild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Farichild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete Product Status Formative / In Design First Production Full Production Not In Production Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I37
FGA70N33BTD Rev. A
9
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